Title :
Determination of Semiconductor Junction Device Package Networks
Author :
Greiling, P.T. ; Laton, R.W.
Abstract :
A general method for the determination of a linear, lumped-element equivalent circuit of any semiconductor device package in any microwave circuit mount is presented. Results are given for IMPATT and TRAPATT devices in coaxial and microstrip circuits, together with experimental validation of the results.
Keywords :
Coaxial components; Electromagnetic heating; Equivalent circuits; Impedance measurement; Microstrip; Microwave circuits; Microwave devices; Microwave theory and techniques; Semiconductor device packaging; Semiconductor devices;
Conference_Titel :
Microwave Symposium Digest, 1974 S-MTT International
Conference_Location :
Atlanta, Georgia, USA
DOI :
10.1109/MWSYM.1974.1123582
