DocumentCode :
2644200
Title :
GeSn channel nMOSFETs: Material potential and technological outlook
Author :
Gupta, S. ; Vincent, B. ; Lin, D.H.C. ; Gunji, M. ; Firrincieli, A. ; Gencarelli, F. ; Magyari-Köpe, B. ; Yang, B. ; Douhard, B. ; Delmotte, J. ; Franquet, A. ; Caymax, M. ; Dekoster, J. ; Nishi, Y. ; Saraswat, K.C.
Author_Institution :
Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2012
fDate :
12-14 June 2012
Firstpage :
95
Lastpage :
96
Abstract :
Semiconducting germanium tin (GeSn) alloy has recently emerged as a candidate for optoelectronic and high performance CMOS devices because of its tunable direct gap and potential for high electron and hole mobilities. High hole mobility in GeSn channel pMOSFETs has already been demonstrated [1, 2]. However, GeSn as channel for nMOSFETs has not yet been explored. In this work we perform detailed theoretical analysis to gauge the benefits of GeSn channel over Ge for nMOSFETs. Our analysis predicts GeSn nMOSFETs to outperform Ge. GeSn n-channel devices have been successfully fabricated and factors limiting its performance.
Keywords :
CMOS integrated circuits; MOSFET; germanium compounds; hole mobility; integrated optoelectronics; GeSn; channel nMOSFET; channel pMOSFET; high performance CMOS devices; hole mobilities; material potential; optoelectronic; technological outlook; Alloying; Annealing; Implants; Logic gates; MOSFETs; Strain; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2012 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4673-0846-5
Electronic_ISBN :
0743-1562
Type :
conf
DOI :
10.1109/VLSIT.2012.6242478
Filename :
6242478
Link To Document :
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