• DocumentCode
    2644346
  • Title

    A rational formulation of thermal circuit models by finite element method and model reduction techniques for electro-thermal simulation

  • Author

    Hsu, J.T. ; Quoc, L.V.

  • Author_Institution
    Florida Univ., Gainesville, FL, USA
  • fYear
    1994
  • fDate
    7-10 Aug 1994
  • Firstpage
    67
  • Lastpage
    72
  • Abstract
    This paper presents a rational approach to construct thermal circuit networks equivalent to a discretization of the heat equation by the finite element method (FEM). After the derivation of FEM-based thermal circuit networks, model reduction techniques are further applied to derive reduced thermal circuit networks for the efficient electro-thermal simulation of power electronic circuits and devices in circuit simulators
  • Keywords
    circuit analysis computing; digital simulation; finite element analysis; heat transfer; power convertors; power engineering computing; power semiconductor devices; semiconductor device models; thermal analysis; FEM; circuit simulators; discretization; electro-thermal simulation; finite element method; heat equation; model reduction techniques; power conversion; power electronic circuits; thermal circuit models; Circuit simulation; Computational modeling; Coupling circuits; Electronic packaging thermal management; Finite difference methods; Finite element methods; Nonlinear equations; Power electronics; Reduced order systems; Symmetric matrices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers in Power Electronics, 1994., IEEE 4th Workshop on
  • Conference_Location
    Trois-Rivieres, Que.
  • Print_ISBN
    0-7803-2091-3
  • Type

    conf

  • DOI
    10.1109/CIPE.1994.396737
  • Filename
    396737