A fully-integrated CAD infrastructure for the design, optimization and virtual manufacturing of discrete and integrable power semiconductor devices and circuits

Author

Shenai, Krishna

Author_Institution

Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

fYear

1994

fDate

7-10 Aug 1994

Firstpage

6

Lastpage

10

Abstract

This paper presents a virtual wafer fabrication infrastructure suitable for power semiconductor development and manufacturing. In the framework, advanced 2D-process and device simulators are interfaced. Mixed-mode circuit simulation is used in which semiconductor device carrier dynamics are optimized in an actual circuit application environment. The results of the circuit simulation are used to develop an optimum device for a given application by carefully trading the process, device, and circuit performance and reliability parameters. The use of this approach is illustrated using the design and optimization of IGBTs in resonant power converter applications

Keywords

bipolar transistor switches; circuit CAD; circuit analysis computing; circuit optimisation; digital simulation; insulated gate bipolar transistors; integrated circuit modelling; mixed analogue-digital integrated circuits; power bipolar transistors; power engineering computing; power integrated circuits; power semiconductor switches; resonant power convertors; semiconductor device models; switching circuits; 2D-process simulators; CAD; IGBTs; applications; circuit design optimisation; development; manufacturing; mixed-mode circuit simulation; performance; power semiconductor devices; reliability; resonant power converter; semiconductor device carrier dynamics; virtual wafer fabrication infrastructure; Circuit optimization; Circuit simulation; Design automation; Design optimization; Fabrication; Insulated gate bipolar transistors; Pulp manufacturing; Resonance; Semiconductor device manufacture; Semiconductor devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers in Power Electronics, 1994., IEEE 4th Workshop on

Conference_Location

Trois-Rivieres, Que.

Print_ISBN

0-7803-2091-3

Type

conf

DOI

10.1109/CIPE.1994.396742

Filename

396742