DocumentCode :
2644556
Title :
The Real World of MIC Packaging [panel discussions]
Author :
Rosenbaum, F.J.
Volume :
74
Issue :
1
fYear :
1974
fDate :
12-14 June 1974
Firstpage :
328
Lastpage :
328
Abstract :
Lists panel discussions held at the conference proceedings.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1974 S-MTT International
Conference_Location :
Atlanta, Georgia, USA
Type :
conf
DOI :
10.1109/MWSYM.1974.1123616
Filename :
1123616
Link To Document :
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