DocumentCode
2644972
Title
Series Interconnection of Six TRAPATT Devices on a Diamond Substrate
Author
Cox, N.W. ; Hill, G.N. ; Amoss, J.W. ; Rucker, C.T.
fYear
1976
fDate
14-16 June 1976
Firstpage
45
Lastpage
47
Abstract
The effects of package parasitic on series interconnections of TRAPATT diode chips on diamond substrates have been studied via time domain computer simulations and experiments at frequencies from 2 to 9 GHz. Guidelines for the selection of package parasitic have been identified, and multichip series configurations, employing six chips mounted thermally in parallel on diamond, have been successfully demonstrated at 7.5 GHz with 35.5 watts output power.
Keywords
Application software; Capacitance; Capacitors; Circuits; Computer simulation; Diodes; Frequency; Guidelines; Packaging; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium, 1976 IEEE-MTT-S International
Conference_Location
Cherry Hill, NJ, USA
Type
conf
DOI
10.1109/MWSYM.1976.1123637
Filename
1123637
Link To Document