• DocumentCode
    2645964
  • Title

    An integrated flow for technology remapping and placement of sub-half-micron circuits

  • Author

    Lou, Jinan ; Salek, Amir H. ; Pedram, Massoud

  • Author_Institution
    Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    1998
  • fDate
    10-13 Feb 1998
  • Firstpage
    295
  • Lastpage
    300
  • Abstract
    This paper presents a new design flow, FPD-SiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic partitioning, floorplanning, global routing, and timing analysis/budgeting steps, followed by technology remapping and detailed placement of the selected logic clusters. The strength of the approach lies in the dynamic programming-based algorithm, SiMPA-D, used for performing simultaneous technology mapping and linear placement of logic clusters. This algorithm generates a set of solutions for each cluster, all of which are noninferior (in terms of gate area, cutwidth and delay), and hence permits trade-offs between total area (gate plus wiring) and total delay (gate plus wiring). Experimental results from a large number of MCNC benchmarks have proved the effectiveness of the proposed flow
  • Keywords
    circuit layout CAD; dynamic programming; logic circuits; logic partitioning; timing; FPD-SiMPA; budgeting steps; dynamic programming-based algorithm; floorplanning; global routing; integrated flow; linear placement; logic circuits; logic partitioning; placement; simultaneous technology mapping; sub-half-micron circuits; technology remapping; timing analysis; total area; total delay; Clustering algorithms; Delay; Heuristic algorithms; Integrated circuit synthesis; Integrated circuit technology; Logic circuits; Partitioning algorithms; Routing; Timing; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference 1998. Proceedings of the ASP-DAC '98. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    0-7803-4425-1
  • Type

    conf

  • DOI
    10.1109/ASPDAC.1998.669472
  • Filename
    669472