• DocumentCode
    2646195
  • Title

    A flexible parameter mismatch sensitivity analysis for VLSI design

  • Author

    To, Hing-yan ; Wong, Waisum

  • Author_Institution
    Intel Corp., Folsom, CA, USA
  • fYear
    1996
  • fDate
    25-27 Jun 1996
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    A sensitivity analysis technique, which is based on Placket Burman Matrix for experimental design is proposed in this report. The response is obtained by simulating an op amp using a SPICE circuit simulator. The response is then used to study the effect of transistor parameter mismatch on circuit performance. This technique models the parameter mismatch effect by creating an addition parameter term. The amount of deviation is a function of fabrication process, bias condition and device type (PMOS or NMOS). The integration method is illustrated in this paper. The modeling method allows parameter variation information to be shared by different nominal device models. The methodology discussed here can be applied to any new circuit topology; hence it is flexible. In addition, the sensitivity analysis provides a quantitative measure while keeping the number of required simulation to the minimum. Therefore, it is readily extended to design automation environment. A unity gain buffer CMOS op amp is used as an example to illustrate the concepts behind this technique
  • Keywords
    CMOS analogue integrated circuits; SPICE; VLSI; integrated circuit design; operational amplifiers; sensitivity analysis; CMOS op amp; NMOS device; PMOS device; Placket Burman Matrix; SPICE circuit simulation; VLSI design; addition parameter; circuit topology; device model; experimental design; integration; sensitivity analysis; transistor parameter mismatch; Circuit optimization; Circuit simulation; Design for experiments; Fabrication; MOS devices; Operational amplifiers; SPICE; Semiconductor device modeling; Sensitivity analysis; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southcon/96. Conference Record
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-8785
  • Print_ISBN
    0-7803-3268-7
  • Type

    conf

  • DOI
    10.1109/SOUTHC.1996.535094
  • Filename
    535094