DocumentCode
2646195
Title
A flexible parameter mismatch sensitivity analysis for VLSI design
Author
To, Hing-yan ; Wong, Waisum
Author_Institution
Intel Corp., Folsom, CA, USA
fYear
1996
fDate
25-27 Jun 1996
Firstpage
363
Lastpage
366
Abstract
A sensitivity analysis technique, which is based on Placket Burman Matrix for experimental design is proposed in this report. The response is obtained by simulating an op amp using a SPICE circuit simulator. The response is then used to study the effect of transistor parameter mismatch on circuit performance. This technique models the parameter mismatch effect by creating an addition parameter term. The amount of deviation is a function of fabrication process, bias condition and device type (PMOS or NMOS). The integration method is illustrated in this paper. The modeling method allows parameter variation information to be shared by different nominal device models. The methodology discussed here can be applied to any new circuit topology; hence it is flexible. In addition, the sensitivity analysis provides a quantitative measure while keeping the number of required simulation to the minimum. Therefore, it is readily extended to design automation environment. A unity gain buffer CMOS op amp is used as an example to illustrate the concepts behind this technique
Keywords
CMOS analogue integrated circuits; SPICE; VLSI; integrated circuit design; operational amplifiers; sensitivity analysis; CMOS op amp; NMOS device; PMOS device; Placket Burman Matrix; SPICE circuit simulation; VLSI design; addition parameter; circuit topology; device model; experimental design; integration; sensitivity analysis; transistor parameter mismatch; Circuit optimization; Circuit simulation; Design for experiments; Fabrication; MOS devices; Operational amplifiers; SPICE; Semiconductor device modeling; Sensitivity analysis; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Southcon/96. Conference Record
Conference_Location
Orlando, FL
ISSN
1087-8785
Print_ISBN
0-7803-3268-7
Type
conf
DOI
10.1109/SOUTHC.1996.535094
Filename
535094
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