DocumentCode :
2646282
Title :
IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
fYear :
2000
fDate :
14-15 July 2000
Abstract :
The following topics were dealt with. DC/DC convertors; power convertors; capacitors; flex technologies; embedded power; thermal simulation; MOSFETs; EMC; MCMs; wire bonding; solder bumping; IGBTs; moulding; 3D packaging; and inductors
Keywords :
power convertors; 3D packaging; DC/DC convertors; EMC; IGBTs; MCMs; MOSFETs; capacitors; embedded power; flex technologies; inductors; moulding; power convertors; solder bumping; thermal simulation; wire bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on
Conference_Location :
Waltham, MA, USA
Print_ISBN :
0-7803-6437-6
Type :
conf
DOI :
10.1109/IWIPP.2000.885109
Filename :
885109
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2646282
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