DocumentCode :
2646318
Title :
Present practice of power packaging for DC/DC converters
Author :
Flannery, J. ; Cheasty, P. ; Meinhardt, M. ; Ludwig, M. ; McCloskey, P. ; Mathúna, C. Ó
Author_Institution :
PEI Technol., Nat. Microelectron. Res. Centre, Cork, Ireland
fYear :
2000
fDate :
2000
Firstpage :
3
Lastpage :
7
Abstract :
This paper presents the results of a detailed benchmarking of the status of power packaging of DC/DC converters in the 100 W range. This work was carried out as part of the StatPEP project which was co-sponsored by the PSMA and PEI Technologies. This benchmarking has established the present best practice in the power electronic packaging of DC/DC power converters currently being manufactured. Ten DC/DC power supplies were identified. The units included two from government and space applications, seven telecom units and one common industrial unit. The main specifications of these supplies are rated power of ~100 W, input voltage of 48 V and single output voltage (Vo) as low as possible in the range 5 V to 2 V. Electrical and thermal properties were measured to confirm individual data sheet specifications. The investigation comprised an analysis of the physical structure of converters, the nature of external packaging, the type of base plates, substrates and potting compounds used as well as the converter´s power/energy/current densities. Also addressed was the interconnect between circuit components, the assembly technology used, overall numbers of components and solder joints and magnetic components (packaging type, technology, level of integration), Of particular interest in the benchmarking process is an analysis of how packaging is used to address thermal and current density issues as well as the identification of suitable figures of merit to quantify the status of power packaging and allow progress to be monitored over time
Keywords :
DC-DC power convertors; assembling; current density; power semiconductor devices; power supply circuits; semiconductor device packaging; soldering; space power generation; surface mount technology; thermal management (packaging); 100 W; 2 to 5 V; 48 V; DC/DC converters; DC/DC power converters; DC/DC power supplies; SMT; StatPEP project; assembly technology; base plates; benchmarking process; circuit component interconnects; components; converter current density; converter energy density; converter physical structure; converter power density; current density; data sheet specifications; electrical properties; external packaging; figures of merit; government applications; industrial unit; input voltage; integration level; magnetic components; monitoring; packaging type; potting compounds; power electronic packaging; power packaging; power semiconductor devices; rated power; single output voltage; solder joints; space applications; substrates; telecom units; thermal properties; Best practices; Current density; DC-DC power converters; Electronic packaging thermal management; Electronics packaging; Manufacturing; Power electronics; Power supplies; Space technology; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on
Conference_Location :
Waltham, MA
Print_ISBN :
0-7803-6437-6
Type :
conf
DOI :
10.1109/IWIPP.2000.885110
Filename :
885110
Link To Document :
بازگشت