An advanced approach to power module packaging

Author

Ozmat, Burhan ; Korman, Charlie S. ; Fillion, Ray

Author_Institution

One Res. Center, GE CRD, Niskayuna, NY, USA

fYear

2000

fDate

2000

Firstpage

8

Lastpage

11

Abstract

Chip-on-flex power overlay technology, the advanced power electronic packaging technology developed at GE CRD, eliminates the need for wire bonds, offers low inductance strip-lined power electrodes, and low parasitic impedance. In addition, the planarity of the top layer structure and the thermal base provide double-sided cooling capability and improve the size, weight, cost, and thermal and electrical performance of the package

Keywords

chip-on-board packaging; cooling; electrodes; inductance; modules; power semiconductor devices; semiconductor device packaging; thermal management (packaging); chip-on-flex power overlay technology; double-sided cooling capability; electrical performance; inductance; package cost; package size; package weight; parasitic impedance; power electronic packaging technology; power module packaging; strip-lined power electrodes; thermal base; thermal performance; top layer structure planarity; wire bonds; Biomembranes; Costs; Dielectric films; Electrodes; Electronic packaging thermal management; Heat sinks; Integrated circuit interconnections; Multichip modules; Thermal resistance; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on

Conference_Location

Waltham, MA

Print_ISBN

0-7803-6437-6

Type

conf

DOI

10.1109/IWIPP.2000.885167

Filename

885167