MCM-D package for power applications

Author

Collado, A. ; Jordà, X. ; Cabruja, E. ; Godignon, P.

Author_Institution

Centro Nacional de Microelectron., CSIC, Barcelona, Spain

fYear

2000

fDate

2000

Firstpage

69

Lastpage

73

Abstract

The aim of this work is the development of a new intelligent power module, called IPMCM (intelligent power multichip module). This module combines the fabrication technology of multichip modules on silicon substrates with that of power transistors. The fabricated IPMCM includes a VDMOSFET at the substrate level and a gate driver at the flip-chip level, in addition to two temperature sensor chips for thermal assessment of the module. A DC-DC converter, an H-bridge circuit, has been implemented by using four of these IPMCMs mounted onto an IMS substrate with some other SMD components for a motor control application

Keywords

DC-DC power convertors; bridge circuits; driver circuits; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; machine control; multichip modules; power integrated circuits; surface mount technology; temperature sensors; thermal management (packaging); DC-DC converter; H-bridge circuit; IMS substrate; IPMCM package; MCM-D fabrication technology; MCM-D package; SMD components; Si; flip-chip level gate driver; intelligent power module; intelligent power multichip module; module thermal assessment; motor control application; multichip modules; power applications; power transistors; silicon substrates; substrate level VDMOSFET; temperature sensor chips; DC-DC power converters; Driver circuits; Fabrication; Intelligent sensors; Motor drives; Multichip modules; Packaging; Power transistors; Silicon; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on

Conference_Location

Waltham, MA

Print_ISBN

0-7803-6437-6

Type

conf

DOI

10.1109/IWIPP.2000.885184

Filename

885184