Title :
Low stress anhydride molding compound for RF applications
Author :
Procter, Philip J. ; Miles, Tara R.
Author_Institution :
Electron. Mater., Dexter Corp., Olean, NY, USA
Abstract :
Anhydride cured epoxy molding compounds offer inherently high glass transition temperature (Tg), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications
Keywords :
adhesion; encapsulation; glass transition; integrated circuit packaging; internal stresses; moulding; permittivity; plastic packaging; power integrated circuits; surface mount technology; thermal expansion; thermal stresses; RF applications; adhesion; anhydride compounds; anhydride cured epoxy molding compounds; anhydride molding compound; anhydride-cured compounds; brittleness; coefficient of thermal expansion; dielectric constant; glass transition temperature; moisture resistance; moldability; shrinkage; stress; surface mount applications; surface mount power applications; Adhesives; Costs; Dielectric constant; Glass; Moisture; Radio frequency; Surface resistance; Temperature; Thermal resistance; Thermal stresses;
Conference_Titel :
Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on
Conference_Location :
Waltham, MA
Print_ISBN :
0-7803-6437-6
DOI :
10.1109/IWIPP.2000.885187
