Low stress anhydride molding compound for RF applications

Author

Procter, Philip J. ; Miles, Tara R.

Author_Institution

Electron. Mater., Dexter Corp., Olean, NY, USA

fYear

2000

fDate

2000

Firstpage

84

Lastpage

88

Abstract

Anhydride cured epoxy molding compounds offer inherently high glass transition temperature (T_g), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications

Keywords

adhesion; encapsulation; glass transition; integrated circuit packaging; internal stresses; moulding; permittivity; plastic packaging; power integrated circuits; surface mount technology; thermal expansion; thermal stresses; RF applications; adhesion; anhydride compounds; anhydride cured epoxy molding compounds; anhydride molding compound; anhydride-cured compounds; brittleness; coefficient of thermal expansion; dielectric constant; glass transition temperature; moisture resistance; moldability; shrinkage; stress; surface mount applications; surface mount power applications; Adhesives; Costs; Dielectric constant; Glass; Moisture; Radio frequency; Surface resistance; Temperature; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on

Conference_Location

Waltham, MA

Print_ISBN

0-7803-6437-6

Type

conf

DOI

10.1109/IWIPP.2000.885187

Filename

885187