• DocumentCode
    2648416
  • Title

    Application of fault simulation test in the VLSI failure analysis

  • Author

    Lin, Xiaoling ; Xiao, Qingzhong ; Yao, Ruohe

  • Author_Institution
    Nat. Key Lab. of Sci. & Technol., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
  • fYear
    2011
  • fDate
    17-19 June 2011
  • Firstpage
    312
  • Lastpage
    315
  • Abstract
    Purpose of VLSI failure analysis is to find effective measure to eliminate or reduce the same failure to happen again. But failure mechanism or failure mode of VLSI is variety. If the VLSI failure analyzer can not find out the root cause, wrong prevention method may be adapted and failure may still happen next time. This paper introduces fault simulation test, which is an effective way to distinguish the similar failure mechanism and confirm the failure mode, such as latch-up effect, electric over stress (EOS), etc. It can provide useful reference information for the users or producers. At the same time, several typical failure analysis cases are used to show how the fault simulation test works.
  • Keywords
    VLSI; failure analysis; VLSI failure analysis; electric over stress; failure mode; fault simulation test; latch-up effect; Circuit faults; Contamination; Failure analysis; Integrated circuit modeling; Pulse width modulation; Reliability; Very large scale integration; contamination; failure analysis; fault simulation test; latch-up;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4577-1229-6
  • Type

    conf

  • DOI
    10.1109/ICQR2MSE.2011.5976619
  • Filename
    5976619