Study of vibration reliability test and simulation for high density PBGA assembly

The PBGA assembly test samples which contain daisy chain patterns were designed; vibration reliability test platform and real-time monitoring platform called Event Detector from Analysis Tech were developed. The vibration reliability test and failure analysis were performed, and the comparative study for experiments and simulation results was carried out. The results showed that the outermost corner solder joint in the PBGA module which was far away from the fixation point was most vulnerable to vibration failure; the solder joint failure presented the characteristics of crack. The crack initiation and propagation was across the solder close to SMD pad on component side. The voids solder joint had poorer vibration fatigue life than the normal solder joint under the same level of vibration excitation. There was adverse influence of void on the vibration fatigue life of solder joint. It represented corresponding relationship between the strain of solder joint and the vibration fatigue life of solder joint. Finally, non-linear dynamic deformation behavior of the PCB assembly was validated under external vibration excitation. The results of the study could help to design new reliable surface mount electronic package based on high vibration reliability.