• DocumentCode
    2648479
  • Title

    Single Event Effects test for CMOS devices using 1064nm pulsed laser

  • Author

    Lei, Zhifeng ; Luo, Hongwei ; Chen, Hui ; Shi, Qian ; He, Yujun

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
  • fYear
    2011
  • fDate
    17-19 June 2011
  • Firstpage
    325
  • Lastpage
    328
  • Abstract
    Presently one challenge facing electronics operating in outer space is that trapped protons and electrons from Earth´s radiation belts and cosmic rays may cause semiconductor devices material ionization during which extra ionized charges inside the device in one single node accumulate to the threshold and SEE (Single Event Effects) occurred, even causing device burned. This paper illustrate the new method of SEE testing using pulsed laser, from which pulsed laser automatic scanning experiment was used to SEE research of DDS (Direct Digital Synthesizer), and SEL (Single event Latch-up), SEFI (Single Event function interruption), and Large frequency jitters had observed in chip scanning process. It is concluded that pulsed laser is a valid supplement for heavy ion accelerator in the test of SEE, and also can testify single event phenomenon in device quickly and help positioning sensitive nodes.
  • Keywords
    CMOS integrated circuits; direct digital synthesis; integrated circuit testing; space vehicle electronics; CMOS devices; chip scanning process; direct digital synthesizer; extraionized charges; large frequency jitters; material ionization; outer space operation; pulsed laser automatic scanning experiment; single event effect test; single event function interruption; single event latch-up; wavelength 1064 nm; Computers; Jitter; Laser beams; Radiation detectors; Semiconductor lasers; Testing; CMOS devices; pulsed Lase; radiation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4577-1229-6
  • Type

    conf

  • DOI
    10.1109/ICQR2MSE.2011.5976622
  • Filename
    5976622