DocumentCode :
2648630
Title :
Congestion-driven floorplanning based on two-stage optimization
Author :
Mao, Fubing ; Ma, Yuchun ; Xu, Ning ; Liu, Shenghua ; Wang, Yu ; Hong, Xianlong
Author_Institution :
WuHan Univ. of Technol., Wuhan, China
fYear :
2009
fDate :
20-23 Oct. 2009
Firstpage :
1298
Lastpage :
1301
Abstract :
In current VLSI design, routing congestion becomes a critical issue with deep submicron design technology. In order to avoid the rip-up and reroute which is a time-consuming process after the placement stage, in this paper, we proposed a new two-stage floorplanning approach for congestion optimization. In our approach we use the method of probability-estimation which uses the extended bounding box to evaluate the routing of nets. We also take use of the strategy of cell perturb to eliminate the routing congestion. Further reduction in congestion is obtained by our algorithm which guided by congestion. We have tested our approach on the MCNC benchmark circuits. The experiments show that our algorithms is efficient, stable and can reduce congestion largely. Compared with the traditional congestion-driven floorplanning, our 2-stage approach can alleviate the congestion efficiently in much shorter time.
Keywords :
VLSI; benchmark testing; circuit layout; circuit optimisation; circuit testing; MCNC benchmark circuits; VLSI design; cell perturb; congestion optimization; congestion-driven floorplanning; deep submicron design technology; extended bounding box; probability-estimation; routing congestion; Circuit testing; Cost function; Delay; Design optimization; Equations; Integrated circuit interconnections; Minimization; Routing; Timing; Very large scale integration; Congestion reduction; Floorplanning; Routability; Routing estimation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
Type :
conf
DOI :
10.1109/ASICON.2009.5351235
Filename :
5351235
Link To Document :
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