• DocumentCode
    2648932
  • Title

    Efficient floor-planning methodology for the Jasper Forest SoC on a 45 nanometer process

  • Author

    Liao, Yuyun ; Raman, Nishi ; Kong, Liping ; Chang, Jung-Yueh

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    2009
  • fDate
    20-23 Oct. 2009
  • Firstpage
    407
  • Lastpage
    410
  • Abstract
    Floor-planning is usually one of design bottleneck for physical design convergence. For a complex SoC such as Jasper Forest, being concurrently developed and integrated with a leading edge CPU (Nehalem), floor-planning becomes even a bigger challenge to convergence on a very tight schedule. This paper highlights the floor-plan methodology and implementation details for Jasper Forest, with 782 million transistors, optimized for a 45 nm process. The methodology features an abutment LEGO structure floor-plan partitioning, a hybrid look-ahead floor-planning methodology, a semi-custom global clock tree construction, and Correct-by-Construction practices. These unique and innovative floor-planning methods enabled us to appropriately decouple complex design processes, minimize design dependencies, avoid non value added steps, and reduce the number of iterations to achieve the business goal of fast turnaround time with fewer resources.
  • Keywords
    circuit layout; nanoelectronics; network synthesis; system-on-chip; Jasper Forest SoC; LEGO structure; correct-by-construction practices; floor-planning; nanometer process; semicustom global clock tree construction; Application specific integrated circuits; Clocks; Convergence; Design methodology; Electrocardiography; Floors; Optimization methods; Process design; Process planning; Technology planning; Floor planning; SoC; global clock tree design; partitioning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2009. ASICON '09. IEEE 8th International Conference on
  • Conference_Location
    Changsha, Hunan
  • Print_ISBN
    978-1-4244-3868-6
  • Electronic_ISBN
    978-1-4244-3870-9
  • Type

    conf

  • DOI
    10.1109/ASICON.2009.5351251
  • Filename
    5351251