• DocumentCode
    2649339
  • Title

    Consequences of internal short-circuits in very high power converters

  • Author

    Januszewski, S. ; Swiatek, H. ; Zymmer, K.

  • Author_Institution
    Power Converter Dept., Electrotech. Inst., Warsaw, Poland
  • Volume
    1
  • fYear
    1996
  • fDate
    17-20 Jun 1996
  • Firstpage
    519
  • Abstract
    As a rule, very high power converters are custom designed. One of the most important problems is a phenomenon of high current flow during internal short circuits caused by semiconductor device breakdown. This situation may result in device package explosion and other damage caused by the destructive action of electrodynamic forces. The proposal of fast fuses elimination, commonly used as short-circuit protection, requires the determination of device explosion strength characteristics (peak value of case destroying current vs. time). Then it is necessary to design such a level of the converter load that the device current will not exceed the admissible value before the tripping of the AC supply circuit-breaker. In the paper, overcurrent protection methods are analysed. Some experiences and test results in this field are given. The mechanisms of destruction of power semiconductor devices caused by very high short-circuit currents are discussed. In conclusion, guidelines for the design of power electronic equipment without fast semiconductor fuse overcurrent protection are given
  • Keywords
    explosions; fault currents; overcurrent protection; power convertors; power semiconductor devices; short-circuit currents; AC supply circuit-breaker; current flow; design guidelines; device explosion strength characteristics; device package damage; experiences; fast fuses elimination; internal short-circuits; overcurrent protection methods; power converters; semiconductor device breakdown; test results; Circuit testing; Electrodynamics; Explosion protection; Fuses; Guidelines; Power electronics; Power semiconductor devices; Proposals; Semiconductor device breakdown; Semiconductor device packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 1996. ISIE '96., Proceedings of the IEEE International Symposium on
  • Conference_Location
    Warsaw
  • Print_ISBN
    0-7803-3334-9
  • Type

    conf

  • DOI
    10.1109/ISIE.1996.548543
  • Filename
    548543