Title :
Advances in CAD for low power design
Author :
Wong, Martin D F
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
High power consumption not only leads to short battery life for mobile devices, but also causes on-chip thermal and reliability problems. In this talk, we present some of our recent results in CAD for low power design.
Keywords :
circuit CAD; circuit reliability; low-power electronics; CAD; high power consumption; low power design; mobile devices; on-chip thermal problem; reliability problems; Batteries; Delay; Design automation; Energy consumption; Field programmable gate arrays; Manufacturing; Power dissipation; Routing; Shape; Wire; glitch-aware routing; low power; manufacturing for design; wire shaping;
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
DOI :
10.1109/ASICON.2009.5351282
