DocumentCode :
2650126
Title :
Electrical failure analysis in high density DRAMs
Author :
Chan, Adrian ; Lam, David ; Tan, Wilson ; Khim, Swee Yong
Author_Institution :
Texas Instrum., Singapore
fYear :
1994
fDate :
8-9 Aug 1994
Firstpage :
26
Lastpage :
31
Abstract :
As density and complexity increase, the search for new test and analysis techniques can impact the role of failure analysis especially in the correct identification of failure mechanisms for root cause fixes to ensure timely introduction of a new product in a relatively competitive market. Design for Testability (DFT) offers some flexibility in trying to meet the demands made on the production test and on the defect analyses by reducing the time per test and in helping to carry out some specific type of tests. This paper presents test results of investigations carried out with the help of some DFT tests on the 1-Megabit, 4-Megabit and 16-Megabit Dynamic Random Access Memories (DRAMs) to detect the cause of an electrical fault in more detail. Several case examples depicting this work are presented
Keywords :
DRAM chips; VLSI; design for testability; fault diagnosis; integrated circuit testing; production testing; 1 to 16 Mbit; design for testability; electrical failure analysis; failure mechanisms; high density DRAMs; production test; time per test; Circuit faults; Circuit testing; Design for testability; Failure analysis; Instruments; Logic arrays; Monitoring; Production; Random access memory; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Technology, Design and Testing, 1994., Records of the IEEE International Workshop on
Conference_Location :
San Jose, CA
Print_ISBN :
0-8186-6245-X
Type :
conf
DOI :
10.1109/MTDT.1994.397201
Filename :
397201
Link To Document :
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