DocumentCode :
2650157
Title :
Prospects for variation tolerant SRAM circuit designs
Author :
Yamauchi, Hiroyuki
Author_Institution :
Fukuoka Inst. of Technol., Fukuoka, Japan
fYear :
2009
fDate :
20-23 Oct. 2009
Firstpage :
621
Lastpage :
624
Abstract :
This paper discusses on prospects for area-scaling capabilities of many kinds of SRAM margin assist solutions for VT variability issue, which are based on various efforts by not only the cell topology changes from 6 T to 8 T and 10 T but also incorporating of multiple cell terminal biasing and timing sequence controls of read and write. The various SRAM solutions are analyzed in light of an impact on the required area overhead for each design solution given by ever increasing VT-random variation (¿VT), resulting in a slowdown in the SRAM scaling pace. It has been shown that 6 T SRAM cell will be allowed a long reign even in 15 nm process node if ¿VT can be suppressed to <70 mV thanks to EOT (Effective Oxide Thickness) scaling for LSTP (Low Standby Power) process, otherwise 10 T and 8 T with read modify write (RMW) will be needed after ¿VT becomes >85 mV and 75 mV, respectively.
Keywords :
SRAM chips; network synthesis; SRAM scaling pace; SRAM solutions; VT-random variation; cell topology; effective oxide thickness; low standby power; multiple cell terminal biasing; timing sequence controls; variation tolerant SRAM circuit designs; wavelength 15 nm; Circuit synthesis; Circuit topology; Costs; Decoding; Interleaved codes; MOSFETs; Random access memory; Regulators; Timing; Voltage; SRAM design solution; SRAM scaling; SRAM scaling trend; deeper nanometer-scale;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
Type :
conf
DOI :
10.1109/ASICON.2009.5351322
Filename :
5351322
Link To Document :
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