Title :
Mega bit BiCMOS SRAM chip package modelling and performance analysis
Author :
Rayapati, Venkatapathi N. ; Kaminska, Bozena
Author_Institution :
Dept. of Electr. Eng., Ecole Polytech. de Montreal, Que., Canada
Abstract :
In this paper, a closed-form expression for CMOS SRAM chip propagation delay is developed. This allows accurate calculation of the signal propagation delay of multilayer interconnects within the CMOS SRAM chip and also takes into account the delay of the CMOS SRAM cells driving the branched transmission line and the driving SRAM cell loading aspects of the interconnect line. Simulation results are presented to show the accuracy and efficiency of the propagation delay model. A case study of 16 Mb CMOS SRAM chip performance evaluation is presented. The proposed closed-form delay expression results in an absolute maximum error smaller than 4.8% in comparison with the measured data. The proposed closed-form expression can be used for various high-speed, high-density multilayer interconnect integrated circuits, FPGAs, and ASICs
Keywords :
BiCMOS memory circuits; SRAM chips; cellular arrays; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; 16 Mbit; BiCMOS; SRAM chip; absolute maximum error; branched transmission line; cell loading aspects; closed-form delay expression; closed-form expression; multilayer interconnects; package modelling; performance analysis; propagation delay; BiCMOS integrated circuits; Closed-form solution; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Propagation delay; Random access memory; SRAM chips; Semiconductor device modeling; Transmission lines;
Conference_Titel :
Memory Technology, Design and Testing, 1994., Records of the IEEE International Workshop on
Conference_Location :
San Jose, CA
Print_ISBN :
0-8186-6245-X
DOI :
10.1109/MTDT.1994.397204