DocumentCode
2650430
Title
Process reliability improvement of microwave module
Author
Li, Ping ; Chen, Yuan
Author_Institution
Sci. & Technol. Lab. of Reliability Phys. & Applic. of Electron. Components, Fifth Res. Inst. of MIIT, Guangzhou, China
fYear
2011
fDate
17-19 June 2011
Firstpage
784
Lastpage
786
Abstract
Process improvement of a microwave module is introduced in this paper. By orthodoxy experiment, die attach strength an bond strength were optimized, so reliability and process consistence of the batch product were ensured.
Keywords
microassembling; microwave devices; reliability; batch product; bond strength; die attach strength; microwave module; orthodoxy experiment; process consistence; process reliability improvement; Electromagnetic heating; Microassembly; Microwave circuits; Microwave oscillators; Reliability; Wires; bond strength; die attach strength; orthodoxy experiment;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4577-1229-6
Type
conf
DOI
10.1109/ICQR2MSE.2011.5976727
Filename
5976727
Link To Document