Title :
Process reliability improvement of microwave module
Author :
Li, Ping ; Chen, Yuan
Author_Institution :
Sci. & Technol. Lab. of Reliability Phys. & Applic. of Electron. Components, Fifth Res. Inst. of MIIT, Guangzhou, China
Abstract :
Process improvement of a microwave module is introduced in this paper. By orthodoxy experiment, die attach strength an bond strength were optimized, so reliability and process consistence of the batch product were ensured.
Keywords :
microassembling; microwave devices; reliability; batch product; bond strength; die attach strength; microwave module; orthodoxy experiment; process consistence; process reliability improvement; Electromagnetic heating; Microassembly; Microwave circuits; Microwave oscillators; Reliability; Wires; bond strength; die attach strength; orthodoxy experiment;
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4577-1229-6
DOI :
10.1109/ICQR2MSE.2011.5976727
