DocumentCode :
265053
Title :
Compensation technique to improve the reliability of SSPA for space applications
Author :
Doshi, R.J. ; Ghodgaonkar, Deepak ; Singh, D.K. ; Bhardhwaj, P.S. ; Das, D.K.
Author_Institution :
Space Applic. Centre, Indian Space Res. Organ., Ahmedabad, India
fYear :
2014
fDate :
15-17 Dec. 2014
Firstpage :
1
Lastpage :
4
Abstract :
A great design challenge for Solid State Power Amplifier (SSPA) designer for space applications is to maintain the optimum, stable & reliable operation under large temperature varying environment of spacecraft. It requires a precise temperature compensation technique to make various parameters like Gain, output power, quiescent current etc. independent of temperature. In absence of such technique it becomes difficult to maintain the device channel temperature of the active device, the most critical parameter, within the specified limit and hence affects the reliability of the system. The paper presents a detailed implementation of the drain current compensation circuit to make the device quiescent current independent of temperature variation and thereby improving the reliability of the space sub-system.
Keywords :
compensation; power amplifiers; reliability; space vehicle electronics; SSPA reliability improvement; active device; device channel temperature; device quiescent current; drain current compensation circuit; large-temperature varying environment; operation reliability; operation stability; optimum operation; output power; solid state power amplifier designer; space applications; space subsystem reliability; spacecraft; temperature compensation technique; temperature variation; Logic gates; MOSFET; Radio frequency; Temperature dependence; Temperature distribution; Temperature sensors; Threshold voltage; Drain; Efficiency; Enhancement mode; MOSFET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial and Information Systems (ICIIS), 2014 9th International Conference on
Conference_Location :
Gwalior
Print_ISBN :
978-1-4799-6499-4
Type :
conf
DOI :
10.1109/ICIINFS.2014.7036618
Filename :
7036618
Link To Document :
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