Title :
Reliability design and analysis of electronic components based FEM simulation technology
Author :
Song, Fangfang ; Niu, Fulin ; He, Xiaoqi
Author_Institution :
Phys. & Applic. of Electron. Component Lab., China Electron. Product Reliability & Environ. Testing Res., Guangzhou, China
Abstract :
Reliability design is the technology that study measures in design process to increase reliability and reach the desired target. With the development of computer, the reliability design and analysis based on Finite Element Method (FEM) simulation technology has became an international and universal method. The paper introduced the application of FEM Simulation Technology on Reliability Design and Analysis of Electronic Components. In this paper, the thermal and vibration characteristics of electronic components were studied using FEM, for example, LED and gridded electron gun. Structural and technics design are studied to improve thermal and vibration reliability.
Keywords :
electron guns; finite element analysis; light emitting diodes; modal analysis; semiconductor device reliability; FEM simulation technology; LED; computer development; electronic components; finite element method; gridded electron gun; reliability analysis; reliability design; thermal reliability; vibration reliability; Analytical models; Finite element methods; Junctions; Light emitting diodes; Reliability engineering; Vibrations; Finite Element Method; junction temperature; modal analysis; natural frequency; reliability design;
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4577-1229-6
DOI :
10.1109/ICQR2MSE.2011.5976738
