Title :
Indium solder printing for low temperature applications and modeling of a droplet generator
Author :
Kessling, Oliver S. ; Werner, Konstantin ; Irlinger, Franz ; Lüth, Tim C.
Author_Institution :
Dept. of Micro Technol. & Med. Device Technol., Tech. Univ. Munchen, Garching, Germany
Abstract :
In this paper a system for solder printing is presented. With the printing system solder bumps can be directly printed on a substrate. The printhead is actuated by an electro-magnetic working principle. After printing the bumps, flip-chips can be placed and reflow soldered. A model to describe the printhead is presented. A differential equation for the movement of the actuated piston was developed. With the help of the conservation of energy and momentum as well as the continuity condition the droplet velocity and droplet volume can be calculated. The calculated values are compared with experimental data.
Keywords :
differential equations; flip-chip devices; indium; low-temperature production; printing; reflow soldering; solders; actuated piston movement; differential equation; droplet generator; droplet velocity; droplet volume; electromagnetic working principle; energy conservation; flip chips; indium solder printing; low-temperature applications; printed substrates; reflow soldering; Actuators; Coils; Indium; Pistons; Printing; Substrates; Wire;
Conference_Titel :
Robotics and Biomimetics (ROBIO), 2010 IEEE International Conference on
Conference_Location :
Tianjin
Print_ISBN :
978-1-4244-9319-7
DOI :
10.1109/ROBIO.2010.5723434
