DocumentCode :
2651509
Title :
Silicon microfabrication technologies for THz applications
Author :
Jung-Kubiak, C. ; Gill, J. ; Reck, T. ; Lee, C. ; Siles, J. ; Chattopadhyay, G. ; Lin, R. ; Cooper, K. ; Mehdi, I.
Author_Institution :
Jet Propulsion Lab., California of Technol., Pasadena, CA, USA
fYear :
2012
fDate :
10-11 June 2012
Firstpage :
1
Lastpage :
2
Abstract :
Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essentials. We report here the development of robust micromachining techniques to enable novel active and passive components in the submillimeter-wave region. These features will enable large format submillimeter-wave heterodyne arrays and 3-D integration in the THz region, where fabricating circuits and structures becomes difficult with conventional machining.
Keywords :
elemental semiconductors; heterodyne detection; micromachining; radiometers; silicon; Si; THz application; active component; micromachining technique; passive component; radiometer-on-a-chip; silicon microfabrication technology; submillimeter-wave heterodyne array; Etching; Microwave radiometry; Microwave technology; Mixers; Optical waveguides; Receivers; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Nanoelectronics Workshop (SNW), 2012 IEEE
Conference_Location :
Honolulu, HI
ISSN :
2161-4636
Print_ISBN :
978-1-4673-0996-7
Electronic_ISBN :
2161-4636
Type :
conf
DOI :
10.1109/SNW.2012.6243285
Filename :
6243285
Link To Document :
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