Integrating RFICs in MCMS

Design for packageability and scaleability is an overhead. Package options can be evaluated by software. MCMs with RFICs are complexity, performance and portability driven, providing electrical and thermal advantages, including high packaging efficiency, miniaturisation, reliability and reduced power consumption. Performance advantages can be obtained by optimizing MCM design, RFIC (within the MCM) design, MESFET (within RFIC and a critical component) design and rest of the circuit (within RFIC and MCM) design. Fast RFIC chips such as GaAs with mixed mode signals are suited to MCMs. Standardized and computer readable RFIC Die Information Exchange format can be input to assembly equipment. Design cycle time can be improved ten fold by first pass success. By measurement of s-parameters equivalent circuit element values of the critical MESFET device can be obtained and by reverse modelling, the physical parameters (like gate width, doping level, etc.) of the device can be obtained. Alternatively, given specifications, the equivalent circuit element values of the MESFET can be determined and the physical parameters derived