Investigations into intrachip wireless interconnection for ultra large scale integration technology

Author

Bialkowski, M. ; Abbosh, A.

Author_Institution

Sch. of ITEE, Univ. of Queensland, Brisbane, QLD, Australia

fYear

2009

fDate

1-5 June 2009

Firstpage

1

Lastpage

4

Abstract

The wireless interconnection has attracted much attention recently as an alternative to the conventional wired interconnection in the ultra large scale integration (ULSI) technology. In this paper, a wireless interconnection operating at 25 GHz, which utilizes novel antenna in the form of a tapered slot structure, is described. The design takes into account an environment similar to the one used in the ultra large scale integration technology. The effects of the existing wired interconnections are included in the performance analysis of this structure. The results, obtained for the wireless link using the new antenna, are compared with those offered by a wired interconnection and the alternative antennas reported in the literature.

Keywords

ULSI; integrated circuit interconnections; microwave integrated circuits; radiocommunication; slot antennas; ULSI technology; frequency 25 GHz; intrachip wireless interconnection; performance analysis; tapered slot structure antenna design; ultra large scale integration technology; wired interconnection; wireless link; Dielectric substrates; Dipole antennas; Directive antennas; Frequency; Integrated circuit interconnections; Packaging; Receiving antennas; Silicon; Transmitting antennas; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE

Conference_Location

Charleston, SC

ISSN

1522-3965

Print_ISBN

978-1-4244-3647-7

Type

conf

DOI

10.1109/APS.2009.5172013

Filename

5172013