Title :
An analysis on VLSI interconnection considering skin effect
Author :
Mido, Tetsuhisa ; Asada, Kunihiro
Author_Institution :
Dept. of Electron. Eng., Tokyo Univ., Japan
Abstract :
In this study, we have developed a two dimensional skin effect simulator by using the split fiber model, that can treat the skin effect as inductive phenomenon of metal wires. Using this simulator, we calculate propagation delay as a function of wiring aspect ratio by considering the skin effect. We estimate propagation delay of both step and slope input and we point out the necessity of considering skin effect in over GHz operation in digital VLSI design
Keywords :
VLSI; circuit analysis computing; integrated circuit interconnections; skin effect; VLSI interconnection; digital VLSI design; metal wires; propagation delay; skin effect; split fiber model; two dimensional skin effect simulator; Conductors; Current density; Dielectric losses; Electromagnetic fields; Frequency; Integrated circuit interconnections; Propagation delay; Skin effect; Surface resistance; Very large scale integration;
Conference_Titel :
Design Automation Conference 1998. Proceedings of the ASP-DAC '98. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
0-7803-4425-1
DOI :
10.1109/ASPDAC.1998.669508
