DocumentCode :
2652776
Title :
Innovative thin film deposition technologies enabling new materials and new device integration roadmaps
Author :
Maes, Jan Willem
Author_Institution :
ASM, Netherlands
fYear :
2011
fDate :
4-7 April 2011
Firstpage :
101
Lastpage :
104
Abstract :
Innovative thin film deposition technologies play a key role in new device scaling strategies that are increasingly based on the use of new materials and 3D approaches. Smart tailor-made equipment solutions have enabled processes that were previously considered impossible for volume manufacturing. Examples of atomic layer deposition and epitaxy techniques for logic and memory devices will be presented as well as spin-offs to applications in solar cells and hard disks.
Keywords :
atomic layer epitaxial growth; digital storage; hard discs; logic devices; solar cells; thin films; atomic layer deposition; device integration roadmaps; epitaxy method; hard disks; logic devices; memory devices; smart tailor-made equipment solutions; solar cells; thin films; Atomic layer deposition; Conferences; Epitaxial growth; Manufacturing; Sputtering; Three dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2011 IEEE International Conference on
Conference_Location :
Amsterdam
ISSN :
1071-9032
Print_ISBN :
978-1-4244-8526-0
Electronic_ISBN :
1071-9032
Type :
conf
DOI :
10.1109/ICMTS.2011.5976869
Filename :
5976869
Link To Document :
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