Title :
Survey of error-tolerant coupled oscillator array design (1994–2007)
Author :
Pearson, L.Wilson
Author_Institution :
Holcombe Dept. Elec. & Comp. Engr., Clemson Univ., Clemson, SC, USA
Abstract :
Beginning in 1994, we engaged substantial activity in coupled oscillator array (COA) systems directed specifically toward millimeter-wave applications. Much of our experimentation has been conducted at lower frequencies for simplicity and cost control, but the methods used have always focused on millimeter wave applications. At millimeter wavelengths, one is constrained to think of integrated or simple hybrid packaging. Perhaps one might build oscillator cells as monolithic circuits and then employ hybrid packaging to incorporate them into an array. Adjustments must be minimal and must be obtainable with a trimming operation on the circuit board. Space is not available for manually controlled devices such as a potentiometer. Further, many applications of millimeter wavelength arrays require low-cost expendable arrays. Traditional build-measure- tweak-integrate-measure-tweak-.... practice in the microwave industry is not acceptable because of cost. Though we have never executed the specifics of packaging, we have envisioned all along a so-called brick architecture array, perhaps realized through egg-carton packaging.
Keywords :
MMIC; coupled circuits; electronics packaging; millimetre wave circuits; network synthesis; oscillators; brick architecture array; circuit board; coupled oscillator array systems; egg-carton packaging; error-tolerant coupled oscillator array design; hybrid packaging; manually controlled devices; microwave industry; millimeter wavelength arrays; millimeter-wave applications; monolithic circuits; oscillator cells; potentiometer; trimming operation; Costs; Frequency; MIMICs; Millimeter wave circuits; Millimeter wave integrated circuits; Millimeter wave technology; Oscillators; Packaging; Potentiometers; Printed circuits;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE
Conference_Location :
Charleston, SC
Print_ISBN :
978-1-4244-3647-7
DOI :
10.1109/APS.2009.5172030