Title :
A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)
Author :
Ryu, Kwang Hyun ; Kwon, Namic ; Seo, Myung Hee ; Lee, Myung Hoon ; Nam, Gi Jung ; Kwak, No Heung
Author_Institution :
Dept. of Phys., Hankuk Univ. of Foreign Studies, Gyonggi-Do
Abstract :
New bonding processes between TCP and glass panel with ACF using HPDL are investigated. Results showed that this method can solve conventional bonding problems caused by pressure unbalance and thermal expansion mismatch of hot plate
Keywords :
bonding processes; conducting materials; laser materials processing; semiconductor lasers; thin films; ACF; HPDL; anisotropic conductive film bonding; glass panel; high power diode laser; hot plate; pressure unbalance; thermal expansion mismatch; Anisotropic conductive films; Bonding processes; Diode lasers; Glass; Heat transfer; Laser beams; Optical films; Power lasers; Temperature; Thermal expansion;
Conference_Titel :
Quantum Electronics and Laser Science Conference, 2005. QELS '05
Conference_Location :
Baltimore, MD
Print_ISBN :
1-55752-796-2
DOI :
10.1109/QELS.2005.1549215
