DocumentCode
2653649
Title
A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)
Author
Ryu, Kwang Hyun ; Kwon, Namic ; Seo, Myung Hee ; Lee, Myung Hoon ; Nam, Gi Jung ; Kwak, No Heung
Author_Institution
Dept. of Phys., Hankuk Univ. of Foreign Studies, Gyonggi-Do
Volume
3
fYear
2005
fDate
27-27 May 2005
Firstpage
1585
Lastpage
1587
Abstract
New bonding processes between TCP and glass panel with ACF using HPDL are investigated. Results showed that this method can solve conventional bonding problems caused by pressure unbalance and thermal expansion mismatch of hot plate
Keywords
bonding processes; conducting materials; laser materials processing; semiconductor lasers; thin films; ACF; HPDL; anisotropic conductive film bonding; glass panel; high power diode laser; hot plate; pressure unbalance; thermal expansion mismatch; Anisotropic conductive films; Bonding processes; Diode lasers; Glass; Heat transfer; Laser beams; Optical films; Power lasers; Temperature; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Quantum Electronics and Laser Science Conference, 2005. QELS '05
Conference_Location
Baltimore, MD
Print_ISBN
1-55752-796-2
Type
conf
DOI
10.1109/QELS.2005.1549215
Filename
1549215
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