• DocumentCode
    2654462
  • Title

    A study of temperature effect on unetched and etched Vertically Aligned Carbon Nanofibers for bio/chemical sensors development

  • Author

    Chalamalasetty, Siva Naga Sandeep ; Wejinya, Uchechukwu C. ; Dong, Zhuxin ; Margis, Matthew R. ; Duensing, Theodore G. ; Chudej, Trent

  • Author_Institution
    Dept. of Microelectron.-Photonics, Univ. of Arkansas, Fayetteville, AR, USA
  • fYear
    2010
  • fDate
    14-18 Dec. 2010
  • Firstpage
    1728
  • Lastpage
    1733
  • Abstract
    One of the major limitations in the development of ultrasensitive electrochemical biosensors based on one dimensional nanostructure is the difficulty involved with reliably fabricating, testing and characterizing nanoelectrode arrays (NEAs). In this work, to ensure nanoelectrode behavior and higher sensitivity, Vertically Aligned Carbon Nano Fibers (VACNFs) are precisely grown on 100 nm Ni dots with 1μm spacing on each micro pad. However, in order to grow nanofibers uniformly, a detailed study on etchant effect and temperature is required. In this paper, we study temperature effect on unetched and etched VACNFs and measure these nanoscale features with Atomic Force Microscope (AFM). With this method, both the 2-D and 3-D images of sample surface are generated and the effect of temperature on carbon nanofiber dimensions (diameter and height) is statistically analyzed.
  • Keywords
    atomic force microscopy; biosensors; carbon; chemical sensors; electrochemical sensors; nanofibres; nanosensors; 2D image; 3D image; atomic force microscope; biosensor development; chemical sensor development; etched VACNF; nanoelectrode array; nanoscale feature; ultrasensitive electrochemical biosensor; unetched VACNF; vertically aligned carbon nano fiber; vertically aligned carbon nanofiber dimension; Atomic force microscopy; Carbon; Force; Humidity; Surface treatment; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Biomimetics (ROBIO), 2010 IEEE International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-9319-7
  • Type

    conf

  • DOI
    10.1109/ROBIO.2010.5723592
  • Filename
    5723592