Title :
A high-throughput cost-effective ASIC implementation of the AES Algorithm
Author :
Cao, Qingfu ; Li, Shuguo
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
This paper proposes a high-throughput cost-effective implementation of AES supporting encryption and decryption with 128-, 192-, and 256-bit cipher key. Optimum irreducible polynomial coefficients are selected to construct the composite field GF(((22)2)2) on standard and normal base in order to minimize the gate count in SubBytes/InvSubBytes transformation. In addition, MixCoulmn/InvMixColumn transformations are optimized and the gate count is the least as we know. And then, a novel on-the-fly key expansion structure is applied to improve the throughput. The performance is evaluated on SMIC 0.18 ¿m CMOS technology and the design has been verified on FPGA. The throughput can achieve at 1.16Gbps with the cost of only 19476 equivalent NAND2 gates, which outperforms prior works with respect to the parameter throughput per kilo gates with the same process.
Keywords :
CMOS integrated circuits; application specific integrated circuits; cryptography; field programmable gate arrays; hardware-software codesign; integrated circuit design; logic gates; 128-bit cipher key; 192-bit cipher key; 256-bit cipher key; AES; ASIC; CMOS technology; FPGA; MixCoulmn-InvMixColumn transformations; NAND2 gates; SubBytes-InvSubBytes transformation; advanced encryption standard; bit rate 1.16 Gbit/s; decryption; encryption; gate count; high-throughput cost-effective implementation; on-the-fly key expansion structure; polynomial coefficients; Application specific integrated circuits; CMOS technology; Computer architecture; Costs; Cryptography; Hardware; NIST; Pipeline processing; Polynomials; Throughput; composite field; irreducible polynomial coefficients; on-the-fly key expansion; standard and normal base;
Conference_Titel :
ASIC, 2009. ASICON '09. IEEE 8th International Conference on
Conference_Location :
Changsha, Hunan
Print_ISBN :
978-1-4244-3868-6
Electronic_ISBN :
978-1-4244-3870-9
DOI :
10.1109/ASICON.2009.5351572