Title :
3D power grid modeling
Author :
Zlydina, Larissa ; Yagil, Yoad
Author_Institution :
M.T.M. Sci. Industries Center, Intel Corp., Haifa, Israel
Abstract :
The paper describes on-chip 3D power grid (PG) modeling for high performance CPU designs. We show that for high frequencies (above 1 GHz) it is necessary to use the full RLM PG model with extracted partial self and mutual conductors\´ inductances, rather than resistive R or RL models. We also present a practical model reduction technique named "real space reduction" (RSR), which enables simplifying the model and reduces memory and simulation time without significant accuracy losses.
Keywords :
VLSI; inductance; microprocessor chips; power supply circuits; reduced order systems; 3D power grid modeling; RLM PG model; extracted partial self inductance; high performance CPU; model reduction technique; mutual conductor inductance; real space reduction; Conductors; Frequency; Geometry; Inductance; Packaging; Power grids; Power system modeling; Variable structure systems; Very large scale integration; Voltage;
Conference_Titel :
Electronics, Circuits and Systems, 2004. ICECS 2004. Proceedings of the 2004 11th IEEE International Conference on
Print_ISBN :
0-7803-8715-5
DOI :
10.1109/ICECS.2004.1399631