• DocumentCode
    2655892
  • Title

    Simulation environments for the high-speed digital subscriber line (HDSL)

  • Author

    Ahamed, Syed V.

  • Author_Institution
    Coll. of Staten Island, City Univ. of New York, NY, USA
  • Volume
    3
  • fYear
    1993
  • fDate
    23-26 May 1993
  • Firstpage
    1791
  • Abstract
    An overview is presented of the high-speed digital subscriber line (HDSL) simulation facilities and selected results from recent CAD environments for HDSL. The evolving integrated network services to the subscribers opens a variety of fundamental questions regarding their digital capabilities. Two significant aspects are covered: the organization of the HDSL CAD environment and the typical results comparing the performance of the limited carrier serving area loop population and with a corresponding performance of all the loops that are less than 12 kft in the typical American subscriber loop environment. The question of the design of the simulation environment which evolves, changes and matures as the applications and requirements change and grow is addressed. Dominant physical, spectral and time domain simulation results for HDSL at H1 and E1 rates with 2B1Q and carrierless amplitude and phase (CAP) modulation techniques for the CSA loops and all loops < 18 kft are presented
  • Keywords
    amplitude modulation; circuit CAD; digital simulation; phase modulation; spectral-domain analysis; subscriber loops; time-domain analysis; CAD environments; HDSL; carrierless amplitude and phase modulation; high-speed digital subscriber line; performance; physical domain; simulation facilities; spectral domain; time domain; Art; Circuit simulation; Computational modeling; DSL; Design automation; Echo cancellers; Educational institutions; Impedance matching; Integrated circuit noise; Software tools;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, 1993. ICC '93 Geneva. Technical Program, Conference Record, IEEE International Conference on
  • Conference_Location
    Geneva
  • Print_ISBN
    0-7803-0950-2
  • Type

    conf

  • DOI
    10.1109/ICC.1993.397589
  • Filename
    397589