Abstract :
The following topics are dealt with: advanced power technology, mixed-signal technology options, RF circuit blocks, high speed circuits, substrate effects and modelling, HBT optimization, thermal parameter extraction and ESD, emerging technologies, bipolar device physics, RF transceivers, BiCMOS platforms; noise and HF characterization.
Keywords :
BiCMOS integrated circuits; DC-DC power convertors; bipolar integrated circuits; electrostatic discharge; heterojunction bipolar transistors; high-speed integrated circuits; integrated circuit noise; mixed analogue-digital integrated circuits; power amplifiers; power transistors; radiofrequency integrated circuits; substrates; BiCMOS circuits; ESD; HBT optimization; HF characterization; RF circuit blocks; RF transceivers; advanced power technology; bipolar circuits; bipolar device physics; electrostatic discharge; heterojunction bipolar transistor; high speed circuits; mixed-signal technology; noise; substrate effects; substrate modelling; thermal parameter extraction;
