DocumentCode :
2656171
Title :
Strained Si n-FET featuring compliant SiGe Stress Transfer Layer (STL) and Si0.98C0.02 source/drain stressors for performance enhancement
Author :
Wang, Grace Huiqi ; Toh, Eng-Huat ; Weeks, Doran ; Landin, Trevan ; Spear, Jennifer ; Tung, Chih Hang ; Thomas, Shawn G. ; Samudra, Ganesh ; Yeo, Yee-Chia
Author_Institution :
Nat. Univ. of Singapore, Singapore
fYear :
2007
fDate :
12-14 Dec. 2007
Firstpage :
1
Lastpage :
2
Abstract :
We report the first demonstration of an n-channel transistor (n-FET) featuring a compliant Si0.75Ge0.25 stress transfer layer (STL) and in situ doped Si0.98C0.02 source/drain (S/D) stressors for performance enhancement. Due to the stress coupling between Si0.98C0.02 and the compliant SiGe STL, additional strain is imparted to the Si channel. Devices with gate length LG down to 30 nm were fabricated. The enhanced strain effects resulted in 65% drive current improvement in strained n-FETs over control n-FETs for a given DIBL of 0.20 V/V.
Keywords :
Ge-Si alloys; elemental semiconductors; field effect transistors; semiconductor materials; silicon; Si; Si0.98C0.02; SiGe; device performance enhancement; n-channel transistor; source-drain stressors; strain effects; strained n-FET; stress coupling; stress transfer layer; CMOS technology; Capacitive sensors; Fabrication; Germanium silicon alloys; Lattices; Silicon germanium; Strain control; Stress; Substrates; Tensile strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1892-3
Electronic_ISBN :
978-1-4244-1892-3
Type :
conf
DOI :
10.1109/ISDRS.2007.4422229
Filename :
4422229
Link To Document :
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