Title :
System-on-flexible-substrates: electronics for future smart-intelligent world
Author :
Zheng, Li-Rong ; Nejad, Majid B. ; Rodriguez, Saul ; Zhang, Lu ; Chen, Cairong ; Tenhunen, Hannu
Author_Institution :
R. Inst. of Technol., Stockholm
Abstract :
In this paper, we present architecture, circuit implementation and integration issues of embedded smart systems on flexible substrates for future ubiquitous intelligent world. The work is exampled by several concepts of innovative, self-powered, long-range interconnected radio-frequency identification and sensor networks in warehouse and intelligent goods distribution systems. Two types of RFID concepts are designed for this network. The first one is a self-powered, ultra-low power UWB RFID. A power scavenging system is designed which can draw energy from the 802.11 access point and its surrounding electromagnetic waves. In the second demonstration, we developed a chipless passive RFID based on time-domain reflection principle. As this RFID is chipless and needs only interconnections and antenna, it is potentially fully printable on flexible substrate such as a paper board. Finally, some implementation and experimental results are presented
Keywords :
embedded systems; flexible electronics; integrated circuit interconnections; intelligent sensors; radiofrequency identification; substrates; ultra wideband technology; 802.11 access point; RFID concepts; chipless passive RFID; electromagnetic waves; embedded smart systems; flexible substrate; intelligent goods distribution systems; power scavenging system; radio-frequency identification; self-powered UWB RFID; sensor networks; system-on-flexible-substrates; time-domain reflection principle; ubiquitous intelligent world; ultra-low power UWB RFID; Electromagnetic scattering; Flexible printed circuits; Integrated circuit interconnections; Intelligent networks; Intelligent sensors; Intelligent systems; Power system interconnection; Radio frequency; Radiofrequency identification; Sensor systems;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0488-6
DOI :
10.1109/HDP.2006.1707561