Author :
Orner, B.A. ; Liu, Q.Z. ; Rainey, B. ; Stricker, A. ; Geiss, P. ; Gray, P. ; Zierak, M. ; Gordon, M. ; Collins, D. ; Ramachandran, V. ; Hodge, W. ; Willets, C. ; Joseph, A. ; Dunn, J. ; Rieh, J.-S. ; Jeng, S.-J. ; Eld, E. ; Freeman, G. ; Ahlgren, D.
Author_Institution :
IBM Microelectron. Div., IBM, Essex Junction, VT, USA
Keywords :
BiCMOS integrated circuits; heterojunction bipolar transistors; semiconductor device manufacture; semiconductor device models; semiconductor process modelling; silicon compounds; 0.13 micron; 200 GHz; 280 GHz; BiCMOS 8HP technology; CMOS node; HBT; SiGe; heterojunction bipolar transistor; BiCMOS integrated circuits; Heterojunction bipolar transistors; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling; Silicon compounds;