Title :
Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern
Author :
Wang, Fuliang ; Li, Junhui ; Han, Lei ; Zhong, Jue
Author_Institution :
Sch. of Mech. & Electronical Eng., Central South Univ., Changsha
Abstract :
Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength
Keywords :
flip-chip devices; mechanical strength; ultrasonic bonding; bonding force; bonding interface; bonding parameters; bonding strength; pressure constraint pattern; thermosonic flip chip bonding; ultrasonic energy; ultrasonic power; Bonding forces; Connectors; Flip chip; Friction; Light emitting diodes; Packaging; Power engineering and energy; SAW filters; Smart cards; Telecommunications;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0488-6
DOI :
10.1109/HDP.2006.1707571
