DocumentCode
2656951
Title
Experimental studies on bonding pressure in wire bonding
Author
Gao, Rongzhi ; Han, Lei ; Zhong, Jue
Author_Institution
Central South Univ., Changsha
fYear
2006
fDate
27-28 June 2006
Firstpage
125
Lastpage
129
Abstract
The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength
Keywords
aluminium; lead bonding; mechanical strength; ultrasonic bonding; 3 mm; Al; U3000 ultrasonic wedge bonder; aluminum wire; bonding pressure; bonding strength; ultrasonic wire bonding; Aluminum; Bonding forces; Frequency; Magnetic forces; Phase locked loops; Seals; Ultrasonic transducers; Vibrations; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0488-6
Type
conf
DOI
10.1109/HDP.2006.1707578
Filename
1707578
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