Experimental research on compulsive cooling of swirling jet impingement

Author

Fu, Yifeng ; Zhou, Jiemin ; Yang, Ying

Author_Institution

Sch. of Energy Sci. & Eng., Central South Univ., Changsha

fYear

2006

fDate

27-28 June 2006

Firstpage

137

Lastpage

140

Abstract

In this research, experiments are carried out to investigate the heat transfer between the swirling impinging jets and an iso-heat-flux simulant chip (a heated epoxy resin plate) by inserting twisted strips into round tubes. In some range of flow Reynolds number, the effects of nozzle-to-plate spacement, the geometries of the nozzle and the thread intervals of the twisted strips are examined, then the radial distribution of Nusselt numbers on the target plate are obtained, so are the Nusselt number correlations. Meanwhile, the heat transfer characteristics of the swirling jet in both the stagnation region and the wall jet region are interpreted. In order to verify its heat transfer effect, the swirling jet is compared to the ordinary straight one

Keywords

cooling; jets; nozzles; swirling flow; thermal management (packaging); Nusselt number correlation; compulsive cooling; flow Reynolds number; heat transfer; heated epoxy resin plate; iso-heat-flux simulant chip; nozzle geometry; nozzle-to-plate spacement; stagnation region; swirling impinging jets; swirling jet impingement; wall jet region; Costs; Electronic components; Electronics cooling; Electronics packaging; Epoxy resins; Geometry; Heat transfer; Power engineering and energy; Strips; Yarn;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707580

Filename

1707580