DocumentCode
2657016
Title
Development and prototyping of a HB-LED array module for indoor solid state lighting
Author
Lee, S. W Ricky ; Lau, C.H. ; Chan, S.P. ; Ma, K.Y. ; Ng, M.H. ; Ng, Y.W. ; Lee, K.H. ; Lo, Jeffery C C
Author_Institution
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon
fYear
2006
fDate
27-28 June 2006
Firstpage
141
Lastpage
145
Abstract
Light emitting diodes (LEDs) have been widely used for a long period of time in various applications such as instrumentation signals, message displays, traffic signals, decoration and personal lighting. With the increase in power rating and the improvement in optical efficiency, LEDs have demonstrated high potential for general lighting applications. In recent years, people became interested in using high brightness LEDs (HB-LEDs) as light sources to replace conventional fluorescent light tubes and lamps. Industrial forecasting indicated that the luminous efficiency of HB-LEDs will be greatly improved in the near future. In addition to increasing luminous efficiency, HB-LEDs have other advantages such as ultra long life, relatively low power consumption, and no UV radiation. These superior properties give HB-LEDs an extra edge over conventional lighting sources. In this study, the coating process for generating white light from blue LEDs was investigated. Furthermore, a prototype of HB-LED array module was fabricated to demonstrate the feasibility of such a lighting device. The outcome of the present study shows that HB-LED array modules should have good potential to replace conventional fluorescent light tubes for indoor solid state lighting (SSL)
Keywords
LED lamps; brightness; light sources; HB-LED array module; blue LED; coating process; high brightness LED; indoor solid state lighting; light emitting diodes; light sources; luminous efficiency; white light generation; Brightness; Displays; Instruments; LED lamps; Light emitting diodes; Light sources; Optical arrays; Prototypes; Solid state lighting; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0488-6
Type
conf
DOI
10.1109/HDP.2006.1707581
Filename
1707581
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