• DocumentCode
    2657210
  • Title

    Newly developed LCP solvent casting film and its applications

  • Author

    Okamoto, Satoshi

  • Author_Institution
    IT-Related Chemicals Res. Lab., Sumitomo Chem. Co., Ltd., Tsukuba
  • fYear
    2006
  • fDate
    27-28 June 2006
  • Firstpage
    177
  • Lastpage
    178
  • Abstract
    Commercial aromatic liquid-crystalline polymers (LCP) are known to be unable to dissolve in any common organic solvents. Recently, we succeeded in the development of innovative solvent-casting type LCP by a design of the molecule structure. In addition to standard LCP film properties such as environmental compatibility, moisture resistance and heat resistance, the casting-type LCP film exhibits less anisotropy, high adhesion to copper foils and peculiar behavior of modulus of elasticity suitable for mounting IC chip. The solvent-casting type LCP has many advantages to be applied for the various electro devices
  • Keywords
    casting; liquid crystal polymers; polymer films; printed circuits; thermal resistance; heat resistance; integrated circuit chip; liquid-crystalline polymers; moisture resistance; molecule structure; organic solvents; solvent casting film; Anisotropic magnetoresistance; Application software; Casting; Chemicals; Dielectrics and electrical insulation; Fabrication; Flexible printed circuits; Liquid crystal polymers; Plastic films; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0488-6
  • Type

    conf

  • DOI
    10.1109/HDP.2006.1707589
  • Filename
    1707589