Abstract :
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. These trends are demonstrated by paper presentations over the past few years at ECTC and other conferences, which show research to be concentrated in relatively few laboratories, with little work being done on the packaging requirements of the new nanoelectronics technologies. Future needs (predictably) include education and software development
Keywords :
carbon nanotubes; conductive adhesives; dielectric materials; filler metals; integrated circuit packaging; nanocomposites; nanoparticles; nanotechnology; carbon nanotubes; composite materials; conductive inks; electrically conductive adhesives; high-k dielectrics; microelectronics packaging; nanoparticle nanocomposites; software development; solder enhancement; underfill fillers; Carbon nanotubes; Composite materials; Conductive adhesives; Electronic packaging thermal management; Electronics packaging; High-K gate dielectrics; Ink; Mechanical factors; Microelectronics; Nanocomposites;
