DocumentCode
2657345
Title
Rapid melt growth of Ge tunnel junctions for interband tunnel transistors
Author
Zhang, Qin ; Sutar, Surajit ; Kosel, Thomas ; Seabaugh, Alan
Author_Institution
Univ. of Notre Dame, Notre Dame
fYear
2007
fDate
12-14 Dec. 2007
Firstpage
1
Lastpage
2
Abstract
In this paper, the authors report on the simulated characteristics of Ge interband tunnel transistors and show the first characteristics of submicron p+n+ junction tunnel junctions using rapid melt growth of Ge. This process uses a phosphorus spin-on diffusant followed by rapid thermal annealing to form the n layer. Aluminum is then deposited by lift-off, capped with Si3N4, and liquified in a rapid thermal processor to dissolve back and regrow the p+ side of the tunnel junction.
Keywords
germanium; tunnel transistors; Ge; interband tunnel transistors; melt growth; submicron junction; tunnel junctions; Current density; Educational institutions; Effective mass; Electron beams; FETs; MOSFET circuits; Photonic band gap; Power dissipation; Rapid thermal processing; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2007 International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-1892-3
Electronic_ISBN
978-1-4244-1892-3
Type
conf
DOI
10.1109/ISDRS.2007.4422291
Filename
4422291
Link To Document