• DocumentCode
    2657402
  • Title

    Evaluation of the new OASIS format for layout fill compression

  • Author

    Chen, Yu ; Kahng, Andrew B. ; Robins, Gabriel ; Zelikovsky, Alexander ; Zheng, Yuhong

  • Author_Institution
    UbiTech, Inc., San Jose, CA, USA
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    377
  • Lastpage
    382
  • Abstract
    A new Open Artwork System Interchange Standard (OASIS) has recently been proposed to replace the GDSII (Graphic Design System II) format. A primary objective of the OASIS format is to enhance the compressibility of layout data. We compare the data compression capability of the full OASIS set of operators with those also present in GDSII, which we refer to as the restricted OASIS format. We measure the compression quality of the OASIS and GDSII operators in two contexts: (1) compressible fill generation, where the fill amounts are specified and compressible fill is then generated; (2) post-fill data compression, where the fill has already been generated and is then compressed. Our experimental results confirm the advantages of the OASIS compression operators: compressed file sizes using the full OASIS format are on average about twice as small as those obtained using the restricted OASIS format. We propose new OASIS-based compression algorithms which outperform industry physical verification tools. We also evaluate the respective merits of the individual repetition operators in OASIS, and suggest possible improvements to the OASIS repetition operators.
  • Keywords
    circuit layout CAD; data compression; engineering graphics; integrated circuit layout; GDSII format; compressible fill generation; data compression; layout data; layout fill compression; open artwork system interchange standard; Compression algorithms; Computer science; Data compression; Data processing; Foundries; Image coding; Layout; Lithography; Manufacturing industries; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems, 2004. ICECS 2004. Proceedings of the 2004 11th IEEE International Conference on
  • Print_ISBN
    0-7803-8715-5
  • Type

    conf

  • DOI
    10.1109/ICECS.2004.1399697
  • Filename
    1399697